Product Cover Image

Handbook of Digital Techniques for High-Speed Design: Design Examples, Signaling and Memory Technologies, Fiber Optics, Modeling, and Simulation to Ensure Signal Integrity (paperback)

By Tom Granberg

Published by Prentice Hall

Published Date: May 24, 2004

Table of Contents

Preface.

I. INTRODUCTION.

 1. Trends in High-Speed Design.


 2. ASICs, Backplane Configurations, and SerDes Technology.


 3. A Few Basics on Signal Integrity.


II. SIGNALING TECHNOLOGIES AND DEVICES.

 4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+).

 5. Low Voltage Differential Signaling (LVDS).

 6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS).

 7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL).

 8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm).

 9. Current-Mode Logic (CML).

10. FPGAs - 3.125 Gbps RocketIOs and HardCopy Devices.

11. Fiber-Optic Components.

12. High-Speed Interconnects and Cabling.

III. HIGH-SPEED MEMORY AND MEMORY INTERFACES.

13. Memory Device Overview and Memory Signaling Technologies.

14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation.

15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM.

16. Quad Data Rate (QDR, QDRII) SRAM.

17. Direct Rambus DRAM (DRDRAM).

18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR.

IV. MODELING, SIMULATION, AND EDA TOOLS.

19. Differential and Mixed-Mode SParameters.

20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs.

21. Modeling with IBIS.

22. Mentor Graphics - EDA Tools for High-Speed Design, Simulation, Verification, and Layout.

V. DESIGN CONCEPTS AND EXAMPLES.

23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects.

Appendix 23A. Generalized N-Port, Mixed-Mode S-Parameters.

24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers.

25. Designing with LVDS.

26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers.

27. WarpLink SerDes System Design Example.

VI. EMERGING PROTOCOLS AND TECHNOLOGIES.

28. Electrical Optical Circuit Board (EOCB).

29. RapidIO.

30. PCI Express and ExpressCard.

VII. LAB AND TEST INSTRUMENTATION.

31. Electrical and Optical Test Equipment.

Acronyms.

References.

About the Author.

Purchase Info

ISBN-10: 0-13-376474-5

ISBN-13: 978-0-13-376474-1

Format: Book

$125.00 | Free Ground Shipping.

Add to Cart